GAS-Rugged

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The OSS GAS-Rugged (GAS-R) offers unprecedented compute density, performance, and flexibility in the first 10 PetaOPS† AI system for rugged edge computing environments.

† INT8 inference with sparsity

SKU: GAS-R Categories: , Tags: , ,

Description

OSS GAS-R features the world’s most advanced accelerator, the NVIDIA® A100 Tensor Core GPU, enabling AI on the Fly® customers to consolidate training, inference, and analytics into a unified, deployable AI solution at the edge. With available rack and flange mounting options, adaptable power subsystem and unheard-of performance in a modest 23” depth aluminum enclosure the GAS-R excels in demanding autonomous driving vehicle and airborne applications with true “Datacenter in the Sky” capability.

AI on the Fly® applications require computing power that can perform an enormous amount of calculations per second. Increasing the compute density of each server node dramatically reduces the number of servers required, resulting in huge savings in cost, power, and space consumed, all tenets of edge AI deployments. Whether your application needs enhanced AI model compute power, high-dimension matrix multiplication, loading and transforming large datasets or scale out inference, eight A100 GPUs with 320 GB high-bandwidth memory, interconnected with six NVSwitches using 3rd generation NVLink at 600GB/s aggregate bandwidth will handle just about any task.

The complete OSS GAS-R solution incorporates building blocks across hardware, networking, software, libraries, and optimized AI models and applications from NGC™. Representing the most powerful end-to-end AI and HPC platform for high-end edge applications, it allows researchers to deliver real-world results in the real world instead of in a sterile environment and deploy solutions into production at scale.

Features

  • 8x NVIDIA® A100 SXM4 GPUs with 4.8TB/s Aggregate NVIDIA® NVLink™ Bandwidth
  • Up to 64 Core AMD Epyc™ 7002 or Dual Intel® Scalable Processors
  • 8U x 23” Depth Enclosure
  • Up to 4TB System Memory
  • Over 200TB PCIe Gen4 NVMe™ Storage
  • Four 200Gb/s NICs
  • System Monitoring and Control through BMC
  • MIL-STD 810G tested
  • AC (50-400Hz) and DC Power Options

Specifications:

Dimensions14.5”H x 17”W (19” rackmount) x 24.5”D
System Weight133lbs
Form Factor8U rack mount, front rack ears, rear dagger pins
System Storage Capacity200TB PCIe 4.0 NVMe flash
CPUUp to 64 Core AMD Epyc™ 7002 or Dual Intel® Scalable Processors
Compute GPUs8x NVIDIA® A100 SXM4 GPUs with NVLINK 3.0
Memory4TB
Network Inputs
  • 4x Ethernet & Infiniband up to 200Gb/s, 4x FibreChannel up to 32Gb
  • Other sensor inputs available using FPGA input modules for sensors, radar, digital, analog I/O
ChassisAnodized Aluminum
Power
  • Rear Power Supply Input: 100-250VAC (47-63 or 400Hz) or 200-370VDC
  • 2+1, hot-swap power system up to 1600W
LEDsFront Status LEDs displaying system power and IPMI Status
System MonitoringIPMI BMC system monitoring through rear RJ45
Environmental Temperature
  • Operating: 0°C to 35°C
  • Storage (non-operating): -40°C to 71°C
  • -500 to 10,000ft Altitude with rapid decompression
Environmental Humidity
  • Operating: 5% to 95% non-condensing
  • Storage (non-operating): 5% to 100% condensing, after drying
ShockTransport (non-operating): ±10g, 11msec, half-sine pulse, 3 shocks per axis each direction
Vibration
  • Operational: 5-2000 Hz, .00004-.015 g2/Hz
  • Non-Operational: 5-2000 HZ, .00015-.06 g2/Hz
  • Transportation in optional transport case: 15-2000 Hz, .01-.3 g2/Hz
Noise80dBA 1m from unit
StandardsTested to MIL-STD-810G, MIL-STD-461E, MIL-STD-464A, MIL-STD-704E, IEC 61000-4-2, conformal coated

Downloads:

Datasheet


Specifications

Dimensions1.75” H x 17.2” W x 25.6” D
CPUsSingle AMD EPYC™ 7002 Series Processor

Socket SP3

Support CPU TDP up to 240W

System Memory8 DIMM slots

Up to 2TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM

DDR 3200 MHz Registered ECC, 288-pin gold-plated DIMMs

Expansion Slots2 PCIe 4.0 x16 FHHL slots

1 PCIe 4.0 x16 (LP) slot

2 PCIe/SATA 3.0 x2 NVMe M.2 slots

Storage Subsystem4 U.2 NVMe Support

4 SATA3 (6Gbps) ports

On-board devicesSystem on chip

SATA 3 (6Gbps)

Network ControllersDual 10GBase-T LAN with via Broadcom BCM57416
USB5 USB 3.0 ports with 4 on rear panel, and 1 Type A internal
Input/Output2 RJ45 10GBase-T ports

1 RJ45 Dedicated IPMI LAN port

5 USB 3.0 ports (4 rear, 1 Type A)

1 VGA port

2 SuperDOM (Disk on Mobile) ports

BIOSAMI 32 Mb SPI flash ROM
Cooling Fans4 Counter-rotating 4cm PWM fans, 2 fans for cooling AOC
Weight22lbs
Power Supply500W
EnvironmentOperating:

  • 5°C to 35°C (41°F to 95°F) at 0 to 915m (3,000ft) altitude
  • 5% to 90% non-condensing relative humidity, max dew point 21°C, max rate of change 5°C/hr

Non-Operating:

  • -20C to 60°C (-40°F to 140°F)
  • 5% to 90% non-condensing relative humidity, max dew point 27°C, max rate of change 5°C/hr
AgencyTested  to conform to the following standards:

  • FCC – Verified to comply with Part 15 of the FCC Rules, Class A
  • Canada ICES-003, issue 4, Class A
  • CE Mark (EN55022 Class A, EN55024, EN61000-3-2, EN61000-3-3)
  • CISPR 22, Class A

Designed  to conform to the following extended standards:

  • NOM-019
  • Argentina IEC60950-1
  • Japan VCCI, Class A
  • Australia/New Zealand AS/NZS CISPR 22, Class A
  • China CCC (GB4943), GB9254 Class A, GB17625.1
  • Taiwan BSMI CNS13438, Class A; CNS14336-1
  • Korea KN22, Class A; KN24
  • Russia/GOST ME01, IEC-60950-1, GOST R 51318.22, GOST R 51318.24, GOST R 51317.3.2,
  • GOST R 51317.3.3
  • TUV-GS (EN60950-1 /IEC60950-1,EK1-ITB2000)
ComplianceRoHS 6 of 6, WEEE