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The 1U GPU accelerated server (OSS-VOLTA4) sets a new standard for HPC compute power in a space efficient design. Supporting four of the latest Volta-based NVIDIA GPUs, the OSS-VOLTA4 provides 31.2 TeraFLOPS of double precision performance for the most demanding HPC applications.

SKU: OSS-AMPERE8 Categories: , Tags: , , ,


The OSS-AMPERE8 is the newest and most powerful PCIe 4.0 AI training and inference platform supporting NVIDIA’s HGX-A100 baseboard with 600GB/s Bi-Directional NVLink 3.0 peer-to-peer GPU connections designed to tackle the largest AI models. Supporting eight of the latest A100 NVIDIA GPUs, the OSS-AMPERE8 provides 2.5 PetaFLOPS TensorFloat 32 for AI training and 10 PetaOPS INT4 AI inference of sparse neural networks for the most demanding HPC applications. The OSS-AMPERE8 comes completely NVIDIA GPU Cloud certified with deep learning frameworks, popular pre-trained models, GPU management and monitoring software preinstalled to provide data scientists the fastest time to actionable intelligence. The GPU accelerated server also includes dual high-performance Future Intel® Xeon® Scalable processors and DDR4 memory scalable to 6TB. Ten PCIe Gen4 x16 slots are available for additional expansion and for scale out creating a balanced 1:1 GPU Ratio when using IB or highspeed Ethernet networking. The appliance includes six 2.5” removable NVMe drive bays.


  • 4U Chassis
  • Dual Future Generation Intel® Xeon® Scalable processors
  • Up to 6TB DDR4 LRDIMM System Memory
  • Six 2.5” NVMe SSD drive bays
  • Eight Ampere GPU SXM4 with 600GB/s NVLink 3.0
  • Ten x16 PCIe 4.0 slots
  • Four 2200W Titanium Power Supplies
  • GPU Management and Monitoring pre-installed
  • Software bundle pre-installed


Dimensions:4U Rack Units 7” H x 17.2” W x 35.2” D (39.3” with rails)
CPUs:Dual Future Generation Intel® Xeon® Scalable processors
System Memory:Memory Capacity

  • 32x 288-pin DDR4 DIMM slots

Memory Type

GPUs:8x Tesla A100 SXM4

  • 10 PetaTOPS INT4*; 2.5 PetaFLOPs Tensor Float 32*, 156 TeraFLOPS FP64
  • 320GB HBM2 Memory
  • 4.8 TB/s Total Aggregate GPU Bandwidth
Software Bundle:Choice of Operating System

  • CentOS
  • RHEL
  • SLES

Choice of Machine Learning Framework

  • Caffe2
  • Pytorch
  • Mxnet
  • Microsoft Cognitive Toolkit
  • Tensorflow
  • Theano
  • MLPython
  • ML Dependencies (400MB Python)
  • cuDNN
  • Caffe on Spark
  • CUDA & NVIDIA driver
  • CUB (CUDA building blocks)
  • NCCL

GPU Management from Bright Computing

  • Health Management
  • Workload Integration
Expansion Slots:PCI-Express

  • Ten PCIe 4.0 x16 LP slots
  • Six PCIe 4.0 x4 U.3 2.5” drive bays
On-board devices:Chipset: Dual Future Intel® Xeon® Scalable Processors
SATA: SATA3 (6Gbps) with RAID 0, 1, 5, 10


  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

Network Controllers

  • Intel® X540 Dual Port 10GBase-T
  • Virtual Machine Device Queues reduce I/O overhead
  • Supports 10GBASE-T, 100

Graphics: ASPEED AST2400 BMC

Drive Bays:Hot-swap 6x 2.5″ Hot-swap NVMe U.3 drive bays
System BIOs:BIOS Type: 128Mb SPI Flash EEPROM with AMI® BIOS
Front Panel:Buttons

  • Power On/Off button
  • System Reset button


  • Power LED
  • Hard drive activity LED
  • Two Network activity LEDs
  • System Overheat LED / Fan fail LED /
Cooling Fans:8x 92mm + 4x 80mm heavy duty counter-rotating fans with air shroud & optimal fan speed control
Power Supply:4x 2200W Redundant Power Supplies with PMBus
Total Output Power: 1200W/1800W/1980W/2200W
Dimension (W x H x L): 73.5 x 40 x 265 mm
Certification: UL/cUL/CB/BSMI/CE/CCC Titanium Level
Environment:Operating Temperature: 10°C to 30°C (50°F to 86°F)
Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Compliance:RoHS 6 of 6, WEEE



Dimensions7” H x 17.2” (19” with rack ears) W x 18.5” D
CPUsDual Intel® Xeon® Scalable Processors up to 205W TDP and 28 cores (Sky Lake, Cascade Lake, Cascade Lake-X)

LGA 3647 socket P with 3 UPI chip-to-chip bus up to 10.7GT/s

System Memory16x 288-pin DDR4 DIMM sockets

Up to 4TB DDR4-2933MHz 3DS ECC RDIMM or LRDIMM, 1.2V low profile

2933/2666/2400/2133MHz Frequencies in 64GB, 128GB and 256GB capacities each module

Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)

Expansion Slots8 Drive Version:

  • 4x PCIe 3.0 x16 full height, 10.5” length, double width slots suitable for GPUs
  • 2 x PCIe 3.0 x16 full height, half length, single width slots
  • 1 x PCIe 3.0 x4 full Height, half length, single width slot with x8 physical connector
  • 1x PCIe3.0 x4 M.2 slot for 2280 and 22110 M-Key modules

16 Drive Version:

  • 2x PCIe 3.0 x16 full height, 10.5” length, double width slots suitable for GPUs
  • 4 x PCIe 3.0 x16 full height, half length, single width slots
  • 1 x PCIe 3.0 x4 full Height, half length, single width slot with x8 physical connector
  • 1x PCIe3.0 x4 M.2 slot for 2280 and 22110 M-Key modules
Storage Subsystem
  • 8 or 16 hot-swap configurable SATA-3, SAS-3 or NVMe x4 2.5” x 15mm drive carriers
    • 12Gb SAS-3 or 6Gb SATA-3 SFF-8680 slots -or-
    • NVMe x4 32Gb slots
  • Up to 10 SATA-3 slots use no PCIe slots
  • 8x and 16x SAS-3 slots require 1 and 2 PCIe x16 HHHL slots respectively
  • 8x and 16x NVMe x2 slots require 1 and 2 x16 PCIe HHHL slots respectively
  • Further expansion up to 4PB possible using OSS JBOF expansion systems
  • 1x M.2 x4 and 2x SATA-DOM internal drive connections
On-board devicesIntel® C621 Express chipset

ASPEED AST2500BMC IPMI support for IPMI 2.0 with virtual medial over LAN and KVM-over-LAN support

Network Controllers2x Intel X550 10Gigabit Ethernet each with an RJ-45

Additional 25, 40 and 100Gb Ethernet, 100Gb Infiniband or 32Gb Fiber Channel interfaces available

USB5 USB 3.0 with 2 on rear panel, 2 on front panel and 1 Type A internal

4 USB 2.0 with 2 on rear panel and 2 internal headers

Input/Output7.1HD Audio Header, 1 VGA port, 2 COM ports (1 rear and 1internal header)

2 Disk-on-Module ports

1 Trusted Platform Management TPM 1.2 20-pin header


Supports PnP, PCI 3.0, ACPI 1.0-4.0, USB keyboard support, UEFI 2.3.1,

1TB BAR1 max size and 256 PCI bus enumeration support

Cooling Fans(4) 16CFM 40x28mm and (2) 60CFM 80x25mm high powered fans mount behind front bezel and cool add-in-cards up to 300w; comes with manual fan speed control dial
ChassisRugged aluminum enclosure

3U honeycomb front bezel with replaceable air filter opens providing access to up to 16 2.5” SATA, SAS, or NVMe SSDs.

Power Supply
  • Dual N+1 1200 watt AC 115-240V Power Supplies
  • Dual N+1 48V DC Input Power Supplies

  • 5°C to 35°C (41°F to 95°F) at 0 to 915m (3,000ft) altitude
  • 5% to 90% non-condensing relative humidity, max dew point 21°C, max rate of change 5°C/hr


  • -20C to 60°C (-40°F to 140°F)
  • 5% to 90% non-condensing relative humidity, max dew point 27°C, max rate of change 5°C/hr
AgencyTested  to conform to the following standards:

  • FCC – Verified to comply with Part 15 of the FCC Rules, Class A
  • Canada ICES-003, issue 4, Class A
  • CE Mark (EN55022 Class A, EN55024, EN61000-3-2, EN61000-3-3)
  • CISPR 22, Class A

Designed  to conform to the following extended standards:

  • NOM-019
  • Argentina IEC60950-1
  • Japan VCCI, Class A
  • Australia/New Zealand AS/NZS CISPR 22, Class A
  • China CCC (GB4943), GB9254 Class A, GB17625.1
  • Taiwan BSMI CNS13438, Class A; CNS14336-1
  • Korea KN22, Class A; KN24
  • Russia/GOST ME01, IEC-60950-1, GOST R 51318.22, GOST R 51318.24, GOST R 51317.3.2,
  • GOST R 51317.3.3
  • TUV-GS (EN60950-1 /IEC60950-1,EK1-ITB2000)
ComplianceRoHS 6 of 6, WEEE