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The 1U GPU accelerated server (OSS-VOLTA4) sets a new standard for HPC compute power in a space efficient design. Supporting four of the latest Volta-based NVIDIA GPUs, the OSS-VOLTA4 provides 31.2 TeraFLOPS of double precision performance for the most demanding HPC applications.

SKU: OSS-VOLTA16 Categories: , Tags: , , ,


The OSS-VOLTA16 is an HGX-2 platform with unprecedented compute power, bandwidth, and memory topology to train massive models, analyze datasets, and solve simulations faster and more efficiently than previously possible in a single server. The 16 Tesla V100 GPUs work as a single unified 2-petaFLOP accelerator with half a terabyte (TB) of total GPU memory, allowing it to handle the most computationally intensive workloads. GPU management and monitoring and software are preinstalled on the OSS-VOLTA16. The GPU accelerated server also includes dual high-performance Intel Scalable Architecture processors with a base configuration of 512GB of DDR4 memory scalable to 3TB. Sixteen PCIe Gen3 slots are available for expansion and scale out OSS-GPUltima clusters using IB or high speed Ethernet networking. The appliance also includes sixteen 2.5” front-removable NVMe drive bays for large model storage.


  • 10U System Chassis
  • Dual Intel Xeon Scalable Architecture CPUs
  • Up to 3TB DDR4 System Memory
  • Sixteen 2.5” NVMe SSDs and six 2.5” SAS drives
  • Sixteen Volta GPU SXM3 with 300GB/s NVLink
  • Sixteen x16 PCIe 3.0 network slots
  • Two x16 PCIe 3.0 expansion slots
  • Six 3000W redundant Power Supplies
  • GPU Management and Monitoring pre-installed
  • NVIDIA optimized frameworks pre-installed


Dimensions:10U Rack Units
15” H x 17.8” W x 27.8” D (437 x 452 x 705 mm)
Fully integrated weight 385lbs (175 kg)
CPUs:Dual Socket P (LGA 3647) Intel® Xeon® Scalable Architecture processors Up to 28 cores and 205W TDP
Up to 28 cores and 205W TDP
System Memory:Memory Capacity

  • 24x 288-pin DDR4 DIMM slots
  • Up to 3TB total memory

Memory Type

  • 2666 MHz ECC DDR4 SDRAM 72-bit
GPUs:16x NVIDIA Tesla V100, SXM3 and 12 NV Switches

  • 2 PetaFLOPS AI performance INT8, 250 TeraFLOPS FP32; 125 TeraFLOPS FP64
  • 500GB total HBM2 GPU Memory
  • 81,920 NVIDIA CUDA cores, 10,240 Tensor cores
  • 2.4TB/s aggregate NVLink switched fabric, GPU to GPU speed
Software Bundle:Choice of Operating System

  • CentOS
  • RHEL
  • SL7

Choice of Machine Learning Framework

  • Caffe2
  • Microsoft Cognitive Toolkit
  • Tensorflow
  • Theano
  • Pytorch
  • Mxnet
  • Chainer
  • MLPython
  • ML Dependencies (400MB Python)
  • cuDNN (5.0 & 5.1)
  • Caffe on Spark
  • CUDA & NVIDIA drivers
  • cuBLAS
  • NCCL

GPU Management

  • Health Management
  • Workload Integration
Expansion Slots:PCI-Express

  • Sixteen PCIe 3.0 x16 slots on PCIe switches
  • Two PCIe 3.0 x16 slots direct connected one to each CPU
On-board devices:Chipset: Intel® C621 chipset
SATA: SATA3 (6Gbps) with RAID 0, 1, 5, 10


  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

Network Controllers

  • Intel® X540 Dual Port 10GBase-T
  • Supports 10GBASE-T, 100BASE-TX, and 1000BASE-T, RJ45 output

Graphics: ASPEED AST2500 BMC

Drive Bays:Hot-swap 16x 2.5″ Hot-swap NVMe drive bays on front
Hot-swap 6x 2.5” SATA drive bays on rear
System BIOs:BIOS Type: 128Mb SPI Flash EEPROM with AMI® BIOS
Front Panel:Buttons

  • Power On/Off button
  • System Reset button


  • Power LED
  • Hard drive activity LED
  • Two Network activity LEDs
  • System Overheat LED / Fan fail LED /
Cooling Fans:8x 4cm heavy duty counter-rotating fans with air shroud & optimal fan speed control
Power Supply:6x 3000W Redundant Power Supplies with PMBus
Total Output Power: 2883W with 200-207 VAC / 3000W with 208-240VAC input
Dimension (W x H x L): 68 x 40 x 430 mm
Certification: UL/cUL/CB/BSMI/CE/CCC Titanium Level
Environment:Operating Temperature: 10°C to 35°C (50°F to 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 10% to 85% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Compliance:RoHS 6 of 6, WEEE



Dimensions7” H x 17.2” (19” with rack ears) W x 18.5” D
CPUsDual Intel® Xeon® Scalable Processors up to 205W TDP and 28 cores (Sky Lake, Cascade Lake, Cascade Lake-X)

LGA 3647 socket P with 3 UPI chip-to-chip bus up to 10.7GT/s

System Memory16x 288-pin DDR4 DIMM sockets

Up to 4TB DDR4-2933MHz 3DS ECC RDIMM or LRDIMM, 1.2V low profile

2933/2666/2400/2133MHz Frequencies in 64GB, 128GB and 256GB capacities each module

Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)

Expansion Slots8 Drive Version:

  • 4x PCIe 3.0 x16 full height, 10.5” length, double width slots suitable for GPUs
  • 2 x PCIe 3.0 x16 full height, half length, single width slots
  • 1 x PCIe 3.0 x4 full Height, half length, single width slot with x8 physical connector
  • 1x PCIe3.0 x4 M.2 slot for 2280 and 22110 M-Key modules

16 Drive Version:

  • 2x PCIe 3.0 x16 full height, 10.5” length, double width slots suitable for GPUs
  • 4 x PCIe 3.0 x16 full height, half length, single width slots
  • 1 x PCIe 3.0 x4 full Height, half length, single width slot with x8 physical connector
  • 1x PCIe3.0 x4 M.2 slot for 2280 and 22110 M-Key modules
Storage Subsystem
  • 8 or 16 hot-swap configurable SATA-3, SAS-3 or NVMe x4 2.5” x 15mm drive carriers
    • 12Gb SAS-3 or 6Gb SATA-3 SFF-8680 slots -or-
    • NVMe x4 32Gb slots
  • Up to 10 SATA-3 slots use no PCIe slots
  • 8x and 16x SAS-3 slots require 1 and 2 PCIe x16 HHHL slots respectively
  • 8x and 16x NVMe x2 slots require 1 and 2 x16 PCIe HHHL slots respectively
  • Further expansion up to 4PB possible using OSS JBOF expansion systems
  • 1x M.2 x4 and 2x SATA-DOM internal drive connections
On-board devicesIntel® C621 Express chipset

ASPEED AST2500BMC IPMI support for IPMI 2.0 with virtual medial over LAN and KVM-over-LAN support

Network Controllers2x Intel X550 10Gigabit Ethernet each with an RJ-45

Additional 25, 40 and 100Gb Ethernet, 100Gb Infiniband or 32Gb Fiber Channel interfaces available

USB5 USB 3.0 with 2 on rear panel, 2 on front panel and 1 Type A internal

4 USB 2.0 with 2 on rear panel and 2 internal headers

Input/Output7.1HD Audio Header, 1 VGA port, 2 COM ports (1 rear and 1internal header)

2 Disk-on-Module ports

1 Trusted Platform Management TPM 1.2 20-pin header


Supports PnP, PCI 3.0, ACPI 1.0-4.0, USB keyboard support, UEFI 2.3.1,

1TB BAR1 max size and 256 PCI bus enumeration support

Cooling Fans(4) 16CFM 40x28mm and (2) 60CFM 80x25mm high powered fans mount behind front bezel and cool add-in-cards up to 300w; comes with manual fan speed control dial
ChassisRugged aluminum enclosure

3U honeycomb front bezel with replaceable air filter opens providing access to up to 16 2.5” SATA, SAS, or NVMe SSDs.

Power Supply
  • Dual N+1 1200 watt AC 115-240V Power Supplies
  • Dual N+1 48V DC Input Power Supplies

  • 5°C to 35°C (41°F to 95°F) at 0 to 915m (3,000ft) altitude
  • 5% to 90% non-condensing relative humidity, max dew point 21°C, max rate of change 5°C/hr


  • -20C to 60°C (-40°F to 140°F)
  • 5% to 90% non-condensing relative humidity, max dew point 27°C, max rate of change 5°C/hr
AgencyTested  to conform to the following standards:

  • FCC – Verified to comply with Part 15 of the FCC Rules, Class A
  • Canada ICES-003, issue 4, Class A
  • CE Mark (EN55022 Class A, EN55024, EN61000-3-2, EN61000-3-3)
  • CISPR 22, Class A

Designed  to conform to the following extended standards:

  • NOM-019
  • Argentina IEC60950-1
  • Japan VCCI, Class A
  • Australia/New Zealand AS/NZS CISPR 22, Class A
  • China CCC (GB4943), GB9254 Class A, GB17625.1
  • Taiwan BSMI CNS13438, Class A; CNS14336-1
  • Korea KN22, Class A; KN24
  • Russia/GOST ME01, IEC-60950-1, GOST R 51318.22, GOST R 51318.24, GOST R 51317.3.2,
  • GOST R 51317.3.3
  • TUV-GS (EN60950-1 /IEC60950-1,EK1-ITB2000)
ComplianceRoHS 6 of 6, WEEE