PCIe Gen 4 3U Short Depth Intel Server (SDS-3U-4i)

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The 20” deep SDS-3U-4i contains two Intel Scalable Processors and provides a feature packed server platform for GPU or FPGA accelerated computing, NVMe storage PCIe Gen 4 expansion slots.

SKU: OSS-SDS-3U-2I Categories: , Tags: , , , ,

Description

The 20” deep SDS-3U-4i contains two Intel Scalable Processors and provides a feature packed server platform for GPU or FPGA accelerated computing, NVMe storage PCIe Gen 4 expansion slots. This functionality is delivered in a size efficient, edge ready rugged chassis with 3U height and 20” depth. This highly integrated server can operate stand alone as a hyperconverged PCIe Gen 4 server or form the core CPU and memory resources for a scale-out, rack level, expandable or composable solution in the shallowest available racks. The SDS-4U-4i features six PCIe Gen 4 x16 full-height slots (four of which are double-width), one PCIe Gen 4 x8 full-height slot and options for 8 or 16 SATA/SAS/NVMe drives. The server supports up to 4TB of memory and a resource expanded BIOS for scale-out device enumeration and large memory mapped I/O used for GPUs and accelerators.

Features

  • Dual Intel® Xeon™ Scalable Ice Lake Processors
  • 20” Depth
  • 2x Internal 2.5” Boot Drives
  • 8x or 16x 2.5” front removable NVMe drives
  • 4 x16 FH dual width plus 2 x16 FH and 1 x8 FH single width PCIe 4.0 slots
  • Embedded Dual-Port 10Gb/e Network Interfaces
  • System Monitoring
  • AC or DC Input Power Supplies
  • Guaranteed to operate with all OSS expansion products

Specifications:

Dimensions5.2” H x 17.0” (19” with rack ears) W x 20.0” D
CPUsDual Intel® Xeon® Ice Lake Scalable CPUs up to 270W TDP and 40 cores

LGA 4189 socket P with 3 UPI chip-to-chip bus up to 11.2GT/s

System Memory16x 288-pin DDR4 DIMM sockets

Up to 4TB DDR4-2933MHz 3DS ECC RDIMM or LRDIMM, 1.2V low profile

2933/2666/2400/2133MHz Frequencies in 64GB, 128GB and 256GB capacities each module

Expansion Slots4x PCIe 4.0 x16 full height, 10.5” length, double width slots suitable for GPUs

2 x PCIe 4.0 x16 full height, half length, single width slots

1 x PCIe 4.0 x8 full Height, half length, single width slot with x8 physical connector

Storage Subsystem8x or 16x hot-swap configurable SATA-3, SAS-3 or NVMe x4 2.5” x 15mm drive carriers

  • 12Gb SAS-3 or 6Gb SATA-3 SFF-8680 slots -or-
  • NVMe x4 32Gb slots

Up to 8 SATA-3 slots use no PCIe slots

8x and 16x SAS-3 slots require 1 and 2 PCIe x16 HHHL slots respectively

8x and 16x NVMe x2 slots require 1 and 2 x16 PCIe HHHL slots respectively

Further expansion up to 4PB possible using OSS JBOF expansion systems such as the SB2000

2x M.2 x4 and 2x SATA-DOM internal drive connection

On-board devices2x Intel X550 10Gigabit Ethernet each with an RJ-45

Additional 25, 40 and 100Gb Ethernet, 100Gb Infiniband or 32Gb Fiber Channel interfaces available

Network Controllers2x RJ45 10GBASE-T LAN from Intel® X550-AT2

1 x RJ45 Dedicated IPMI LAN port from RTL8211E

USB6x USB 3.0 with 4 on rear panel, 1x header and 1x Type A internal 2x USB 2.0 (1 internal header)
Input/Output7.1HD Audio Header, 1 VGA port, 2 COM ports (1 rear and 1internal header)

2x Disk-on-Module ports

1x Trusted Platform Management TPM 1.2 20-pin header

BIOS128 Mb SPI flash EEPROM with AMI BIOS

Supports PnP, PCI 3.0, ACPI 1.0-4.0, USB keyboard support, UEFI 2.3.1, 1TB BAR1 max size and 256 PCI bus enumeration support

Cooling Fans(6) 40x56mm and (1) 80x38mm high powered fans mount behind front bezel and cool add-in-cards up to 300w; comes with manual fan speed control dial
ChassisRugged steel enclosure. Aluminum options available for low-weight applications.

3U honeycomb front bezel with replaceable air filter opens providing access to up to 16 2.5” SATA, SAS, or NVMe SSDs.

Weight45lbs
Power SupplyDual N+1 1200 watt AC 115-240V Power Supplies

Dual N+1 48V DC Input Power Supplies

EnvironmentOperating:

  • 10°C to 35°C (50°F to 95°F) at 0 to 915m (3,000ft) altitude
  • 5% to 90% non-condensing relative humidity, max dew point 21°C, max rate of change 5°C/hr

Non-Operating: –

  • 40°C to 70°C (-40°F to 158°F)
  • 5% to 90% non-condensing relative humidity, max dew point 27°C, max rate of change 5°C/hr
AgencyTested  to conform to the following standards:

  • FCC – Verified to comply with Part 15 of the FCC Rules, Class A
  • Canada ICES-003, issue 4, Class A
  • CE Mark (EN55022 Class A, EN55024, EN61000-3-2, EN61000-3-3)
  • CISPR 22, Class A
  • MIL-STD-810G

Designed  to conform to the following extended standards:

  • NOM-019
  • Argentina IEC60950-1
  • Japan VCCI, Class A
  • Australia/New Zealand AS/NZS CISPR 22, Class A
  • China CCC (GB4943), GB9254 Class A, GB17625.1
  • Taiwan BSMI CNS13438, Class A; CNS14336-1
  • Korea KN22, Class A; KN24
  • Russia/GOST ME01, IEC-60950-1, GOST R 51318.22, GOST R 51318.24, GOST R 51317.3.2, GOST R 51317.3.3
  • TUV-GS (EN60950-1 /IEC60950-1,EK1-ITB2000)
ComplianceRoHS 3, WEEE

Downloads:

Datasheet


Specifications

Dimensions7” H x 17.2” (19” with rack ears) W x 18.5” D
CPUsDual Intel® Xeon® Scalable Processors up to 205W TDP and 28 cores (Sky Lake, Cascade Lake, Cascade Lake-X)

LGA 3647 socket P with 3 UPI chip-to-chip bus up to 10.7GT/s

System Memory16x 288-pin DDR4 DIMM sockets

Up to 4TB DDR4-2933MHz 3DS ECC RDIMM or LRDIMM, 1.2V low profile

2933/2666/2400/2133MHz Frequencies in 64GB, 128GB and 256GB capacities each module

Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)

Expansion Slots8 Drive Version:

  • 4x PCIe 3.0 x16 full height, 10.5” length, double width slots suitable for GPUs
  • 2 x PCIe 3.0 x16 full height, half length, single width slots
  • 1 x PCIe 3.0 x4 full Height, half length, single width slot with x8 physical connector
  • 1x PCIe3.0 x4 M.2 slot for 2280 and 22110 M-Key modules

16 Drive Version:

  • 2x PCIe 3.0 x16 full height, 10.5” length, double width slots suitable for GPUs
  • 4 x PCIe 3.0 x16 full height, half length, single width slots
  • 1 x PCIe 3.0 x4 full Height, half length, single width slot with x8 physical connector
  • 1x PCIe3.0 x4 M.2 slot for 2280 and 22110 M-Key modules
Storage Subsystem
  • 8 or 16 hot-swap configurable SATA-3, SAS-3 or NVMe x4 2.5” x 15mm drive carriers
    • 12Gb SAS-3 or 6Gb SATA-3 SFF-8680 slots -or-
    • NVMe x4 32Gb slots
  • Up to 10 SATA-3 slots use no PCIe slots
  • 8x and 16x SAS-3 slots require 1 and 2 PCIe x16 HHHL slots respectively
  • 8x and 16x NVMe x2 slots require 1 and 2 x16 PCIe HHHL slots respectively
  • Further expansion up to 4PB possible using OSS JBOF expansion systems
  • 1x M.2 x4 and 2x SATA-DOM internal drive connections
On-board devicesIntel® C621 Express chipset

ASPEED AST2500BMC IPMI support for IPMI 2.0 with virtual medial over LAN and KVM-over-LAN support

Network Controllers2x Intel X550 10Gigabit Ethernet each with an RJ-45

Additional 25, 40 and 100Gb Ethernet, 100Gb Infiniband or 32Gb Fiber Channel interfaces available

USB5 USB 3.0 with 2 on rear panel, 2 on front panel and 1 Type A internal

4 USB 2.0 with 2 on rear panel and 2 internal headers

Input/Output7.1HD Audio Header, 1 VGA port, 2 COM ports (1 rear and 1internal header)

2 Disk-on-Module ports

1 Trusted Platform Management TPM 1.2 20-pin header

BIOS128 Mb SPI flash EEPROM with AMI BIOS

Supports PnP, PCI 3.0, ACPI 1.0-4.0, USB keyboard support, UEFI 2.3.1,

1TB BAR1 max size and 256 PCI bus enumeration support

Cooling Fans(4) 16CFM 40x28mm and (2) 60CFM 80x25mm high powered fans mount behind front bezel and cool add-in-cards up to 300w; comes with manual fan speed control dial
ChassisRugged aluminum enclosure

3U honeycomb front bezel with replaceable air filter opens providing access to up to 16 2.5” SATA, SAS, or NVMe SSDs.

Weight45lbs
Power Supply
  • Dual N+1 1200 watt AC 115-240V Power Supplies
  • Dual N+1 48V DC Input Power Supplies
EnvironmentOperating:

  • 5°C to 35°C (41°F to 95°F) at 0 to 915m (3,000ft) altitude
  • 5% to 90% non-condensing relative humidity, max dew point 21°C, max rate of change 5°C/hr

Non-Operating:

  • -20C to 60°C (-40°F to 140°F)
  • 5% to 90% non-condensing relative humidity, max dew point 27°C, max rate of change 5°C/hr
AgencyTested  to conform to the following standards:

  • FCC – Verified to comply with Part 15 of the FCC Rules, Class A
  • Canada ICES-003, issue 4, Class A
  • CE Mark (EN55022 Class A, EN55024, EN61000-3-2, EN61000-3-3)
  • CISPR 22, Class A

Designed  to conform to the following extended standards:

  • NOM-019
  • Argentina IEC60950-1
  • Japan VCCI, Class A
  • Australia/New Zealand AS/NZS CISPR 22, Class A
  • China CCC (GB4943), GB9254 Class A, GB17625.1
  • Taiwan BSMI CNS13438, Class A; CNS14336-1
  • Korea KN22, Class A; KN24
  • Russia/GOST ME01, IEC-60950-1, GOST R 51318.22, GOST R 51318.24, GOST R 51317.3.2,
  • GOST R 51317.3.3
  • TUV-GS (EN60950-1 /IEC60950-1,EK1-ITB2000)
ComplianceRoHS 6 of 6, WEEE